Electronic mega-giant, Samsung Electronics Co. Ltd has revealed that they have developed the world’s first 32 Gigabyte (GB) DDR3 module for server systems in response to the global trend to save energy and cut down on power.
The 32 GB module offers four times the density at significantly reduced power levels compared to the 8 GB memory modules of today. The 32 GB uses 1.35 volts which will not only reduce power levels but also help to reduce the overall electronic footprint.
Jim Elliot, the vice president of memory marketing for Samsung Semiconductor, Inc. assures users that the 32 GB module is still a powerhouse in energy efficiency and performance for data centres. The lower level of power consumption will provide a cutback on installation fees, maintenance and repairs as well as a visible decrease in electricity bills. It will improve throughput by 20% compared to the 1.5V DDR3 module and increase the overall operational efficiency of data centres.
The 32 GB module is inspired by the Samsung’s 50 nanometre (nm) – class 4 GB DDR3. The 32 GB model uses 72 4 GB DDR3 chip and nine quad-die package (QDP) 16 GB DDR3’s for a collective 32 GB configuration.
The DDR3 DRAM market accounts for 29% of the total DRAM market in 2009 and the International Data Corporation (IDC) estimates this number to rise to 75% in 2011. Furthermore, according to the IDC, 2 GB or higher DDR3 DRAM will rise from 3% to 33% of the total DRAM market by 2011.
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